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C/D750 Solid-State Drive Series

Product Highlights

  • NVMe Support
  • High and Consistent Performance
  • Proven Data Reliability
  • Hot-Pluggable
  • MemSolid2.0

Hot-Pluggable

SFF-8639 Supported, Front-end maintenance support

The PBlaze4 2.5’’ form factor adheres to U.2 provisions for hot plug, hot removal and hot swap. PBlaze4 Serials will guarantee the integrity of data both already committed to non-volatile NAND media and cached writes commit to media during hot plug operation.

Increased Return on Investment

Low Host Memory and Compute Overhead, Increased Density, Reduced TCO

Utilizing Memblaze’s innovative Device-based Architecture, PBlaze4 can significantly reduce host system overhead (1MB memory occupy). With the flexibility of 2.5’’ form factor, it is effective to reduce deployment time, increase the PCIe SSD density and, save operating expense for data centers and reduce the total cost of ownership (TCO).

Technical Specifications

PBlaze4 Series PBlaze4 C/D750 [1] [2] PBlaze4HE C/D750[1][2]
User Capacity 800GB                 1.2T*                 1.6T                 2.4T*                 3.2T*                 3.2T*
Sequential Read(128KB)                 2.4 GB/s                 2.9 GB/s                 2.9 GB/s                 2.9 GB/s                 2.8 GB/s                 3.0 GB/s
Sequential Write (128KB)                 700 MB/s                 1.4 GB/s                 1.4 GB/s                 2.3 GB/s                 2.3 GB/s                 1.6 GB/s
Sustained Random Read (4KB) IOPS                 600K                 740K                 740K                 700K                 700K                 750K
Sustained Random Write (4KB) IOPS (Steady State / Peek) [3]                 60K/170K                 240K/350K                 140K/350K                 310K/580K                 170K/580K                 140K / 435K
Lifetime Endurance DWPD[4]                 3                 4                 3                 4                 3                 9
Latency Read/Write [5]                 96μs / 16μs 96μs / 14μs
Uncorrectable Bit Error Rate (UBER)                 < 10-17
Mean Time Between Failures (MTBF)                 2 million hours
Form Factor                 2.5-inch / HHHL
Interface                 PCIe 3.0 x 4
Dimensions

2.5-inch: 61.72mm x 100.20mm x 15.00mm
HHHL: 68.9mm x 167.65mm x 18.74mm

Protocol                 NVMe 1.1b
NAND Flash Memory MLC eMLC,(Global Wear-Leveling)
Operation System                 RHEL, SLES, CentOS, Ubuntu, Windows Server, VMware ESXi
Power Consumption                 ≤ 25w
Operating temperature

AIC: 0 – 55℃ ambient temperature with suggested airflow
2.5-inch: 0–35℃ ambient temperature with suggested airflow, 0-70℃ case temperature

Airflow(LFM)                 300LFM@25℃
Software Support                 CLI Management Tool, OS in-box driver
Certification

America:FCC China:BSMI Europe:CE, RoHS, WEEE


Note:
* Random workload and endurance optimized SKU.
[1].D750 default power mode is 20W.
[2].Performance is in tuning, changes may make.
[3].Measurement is performed at 100% disk span and fresh out of the box (FOB).
[4].DWPD: Drive Write Per Day for 3 years.
[5].Average latency measured with 4KB random I/O pattern.


中文

Technical Support: support@memblaze.com

Sales Email: contact@memblaze.com